A filler developed to maximise bond strength in hardware bonding where high cyclic loads are anticipated.
With this, rather heavy filler, epoxy of highest compressive and tensile strength can be produced.
It can also be used for filleting and gap-filling applications, but it is difficult to grind.
May be added to the resin/hardener at a rate of 35% to 60% by weight, depending on the viscosity needed.
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